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Titan 300 TGL-UP3 AI

Name: Titan 300 TGL-UP3 AI
SKU: Titan 300 TGL-UP3 AI

不帶風扇的嵌入式計算機，配備第11代英特爾? Core?和英特爾? Celeron? SoCs（代號：Tiger Lake UP3）以及Axelera AI芯片：由單個Metis AIPU提供動力，最高可達120 TOPS

Product status

Development

Sampling

Production

Data Sheet

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CPU

11th Gen Intel? Core? processors and Intel? Celeron? SoCs

Graphics

Intel? Iris? Xe architecture with up to 96 EUs, up to 4 independent displays

Connectivity

2x 2.5 GbE, Optional M.2 WWAN and WLAN modules

Memory

Two DDR4 SO-DIMM slots supporting DDR4-3200 ECC memory with IBECC

Product details

Technical Info

Description

不帶風扇的嵌入式計算機，配備第11代英特爾? Core?和英特爾? Celeron? SoCs（代號：Tiger Lake UP3）以及Axelera AI芯片：由單個Metis AIPU提供動力，最高可達120 TOPS
Processor
- Intel? Core? i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, 28W TDP (12W cTDP)
- Intel? Core? i5-1145G7E, Quad Core @ 2.6GHz (4.1GHz Turbo) with HT, 8MB cache, 28W TDP (12W cTDP)
- Intel? Core? i3-1115G4E, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT, 6MB cache, 28W TDP (12W cTDP)
- Intel? Celeron? 6305E, Dual Core @1.8GHz, 4MB cache, 15W TDP
- Intel? Core? i7-1185GRE, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, with IBECC, 28W TDP (12W cTDP) – Industrial
- Intel? Core? i5-1145GRE, Quad Core @ 2.6GHz (4.1GHz Turbo) with HT, 8MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial
- Intel? Core? i3-1115GRE, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT, 6MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial
AI Chip: 100+ TOPS inference power - Voyager SDK for effortless deployment of AI applications
Memory

2x DDR4-3200 SODIMM slots
Up to 64GB (IBECC supported only with Core? industrial SoCs)
Graphics

Up to two video decode boxes (VDBoxes) for enhanced video stream capabilities
Support for up to four independent displays at up to 4K60 HDR resolution or one display at 8K resolution
Video Interfaces

2x Multimode DisplayPort 1.4, on dual DP++ connector
2x Multimode Display Port 1.4 on USB Type-C connectors (alternate mode)
Video Resolution

DP: up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC
HDMI 1.4: up to 4Kx2K 24-30Hz 24bpp
Mass Storage

On-Board NMVe Drive, up to 2 modules with global capacity up to 1TB
Networking

2x 2.5 Gigabit Ethernet RJ45 connectors Optional on-board M.2 Wi-Fi (802.11 ac / a / b / g / n) + BT 5.0 module, with dipole antennas included*
Optional on-board M.2 LTE modem with Mini-SIM slot, with dipole antennas included*

*Certification upon request
USB

2x Superspeed USB 10Gbps ports on Dual Type-A sockets
2x Superspeed USB 20Gbps on USB Type-C slots
Audio

Lineout + MicIn combo TRRS Audio Jack
Serial Ports

2x RS-232/RS-422/RS-485 UARTS software configurable, on DB9 connector
Other Interfaces

Optional 2x 12 poles terminal block connectors with the following I/O:
? 8x GPIOs
? 1x I2C
? 1x SPI
? 1x 5V
? 1x 3.3V
? 1x 12V
? 3x GND

Power ON Button
Optional TPM 1.2/2.0 module on-board
Power Supply

12VDC to 24VDC range, Mega-Fit 2p RA Connector
Coin cell battery for RTC On-Board
Operating System

Microsoft? Windows 10 IoT Enterprise LTSC 2021
Linux (Kernel ≥ 5.4 version)
Operating Temperature

Commercial range: 0°C to +40°C, with 0.7m/s airflow**
Extended range: -30°C to +40°C, with 0.7m/s airflow**

**Up to 60°C with scaled down CPU TDP
Dimensions

199 x 174 x 73 mm (7.83’’ x 6.85 “ x 2.87’’) DIN-rail or Wall Mount brackets (Factory Alternatives)